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MF-FSMF035X 데이터시트(PDF) 3 Page - Bourns Electronic Solutions

부품명 MF-FSMF035X
상세설명  MF-FSMF Series - PTC Resettable Fuses
PDF  7 Pages
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제조업체  BOURNS [Bourns Electronic Solutions]
홈페이지  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

MF-FSMF035X 데이터시트(HTML) 3 Page - Bourns Electronic Solutions

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MF-FSMF Series - PTC Resettable Fuses
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
How To Order
MF - FSMF 020 X - 2
Multifuse® Product
Designator
Series
FSMF = 0603 Surface Mount
Component
Hold Current, Ihold
010-050 (0.10 - 0.50 Amps)
Multifuse® freeXpansion™ Design
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Typical Part Marking
PART IDENTIFICATION:
MF-FSMF010X = II
MF-FSMF020X = I
MF-FSMF025X = +
MF-FSMF035X = •
MF-FSMF050X = —
BI-WEEKLY DATE CODE WILL APPEAR ON THE PACKAGING LABEL:
WEEK 1 AND 2 = A
WEEK 51 AND 52 = Z
Packaging Quantity
Model
Packaging Quantity
MF-FSMF010X
5,000 pcs. per reel
MF-FSMF020X
6,000 pcs. per reel
MF-FSMF025X
6,000 pcs. per reel
MF-FSMF035X
6,000 pcs. per reel
MF-FSMF050X
4,000 pcs. per reel
Solder Reflow Recommendations
Notes:
MF-FSMF models are intended for reflow soldering (including, but not
limited to heating plate, hot air, IR, nitrogen, and vapor phase).
Wave soldering is permissible only if the device is on the top of the
PCB, opposite the heat source.
Hand soldering is not recommended for these devices.
All temperatures refer to the topside of the device, measured on the
device body surface.
If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit.
Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering
Recommendations document for more details.
TP
TP
tp
t s
TTO
RAMP-UP
L
TL
t L
25
Ts max
Ts min
PREHEAT
Time
CRITICAL ZONE
RAMP-DOWN
t 25 °C TO PEAK
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to Tp)
3 °C / second max.
PREHEAT:
Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
Time (Tsmin to Tsmax) (ts)
150 °C
200 °C
60~180 seconds
TIME MAINTAINED ABOVE:
Temperature (TL)
Time (tL)
217 °C
60~150 seconds
Peak Temperature (Tp)
260 °C
Time within 5 °C of Actual Peak Temperature (tp)
20~40 seconds
Ramp-Down Rate
6 °C / second max.
Time 25 °C to Peak Temperature
8 minutes max.



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