LP3871, LP3874

SNVS225H – FEBRUARY 2003 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Input supply voltage (survival)

−0.3

7.5

V

Shutdown input voltage (survival)

−0.3

7.5

V

Output voltage (survival)(3)(4)

−0.3

6

V

IOUT (survival)

Short-circuit protected

Maximum voltage for ERROR Pin

VIN

V

Maximum voltage for SENSE Pin

VOUT

V

Power dissipation(5)

Internally Limited

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.

(4)

The output PMOS structure contains a diode between the IN and OUT pins. This diode is normally reverse biased. This diode will get

forward biased if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically

withstand 200 mA of DC current and 1 A of peak current.

(5)

Internal thermal shutdown circuitry protects the device from permanent damage.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input supply voltage(1)

2.5

7

V

Shutdown input voltage

−0.3

7

V

Maximum operating current (DC)

0.8

A

Junction temperature

−40

125

°C

(1)

The minimum operating value for VIN is equal to either [VOUT(NOM) + VDROPOUT] or 2.5 V, whichever is greater.

6.4 Thermal Information

LP3871, LP3874

THERMAL METRIC(1)

NC (SOT-223)

KTT (DDPAK/TO-263)

UNIT

5 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

65.2

40.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

47.2

43.4

°C/W

RθJB

Junction-to-board thermal resistance

9.9

23.1

°C/W

ψJT

Junction-to-top characterization parameter

3.4

11.5

°C/W

ψJB

Junction-to-board characterization parameter

9.7

22

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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