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EXAMPLE BOARD LAYOUT

12X (

0.225)

(0.5) TYP

(0.5) TYP

(

0.225)

METAL

0.05 MAX

SOLDER MASK

OPENING

METAL

UNDER

MASK

(

0.225)

SOLDER MASK

OPENING

0.05 MIN

DSBGA - 0.5 mm max height

YZP0012-C01

DIE SIZE BALL GRID ARRAY

4224761/A 01/2019

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).

1

SYMM

LSF0204/LSF0204D

SYMM

LAND PATTERN EXAMPLE

SCALE:30X

D

C

2

3

A

B

NON-SOLDER MASK

DEFINED

(PREFERRED)

NOT TO SCALE

SOLDER MASK DETAILS

SOLDER MASK

DEFINED

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LSF0204, LSF0204D

SLVSCP5H – JULY 2014 – REVISED APRIL 2021

Copyright © 2022 Texas Instruments Incorporated

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Product Folder Links: LSF0204 LSF0204D