6

JS-KS Series

CAUTIONS

GENERAL INFORMATION

1. ROHS Compliance

• All relays produced by FCL Components are compliant with RoHS directive 2011/65/EU, including

commission delegated directive 2015/863.

Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.

This material has been verified to be compatible with PbSn assembly process.

2. Recommended lead free solder condition

•

• Recommended solder for assembly: Sn-3.0Ag-0.5Cu.

3. Moisture Sensitivity

• Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise

indicated.

4. Tin Whiskers

• Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable

length whisker was found by our in house test.

Flow Solder Condition:

Pre-Heating:

Soldering:

Dip within 5 sec. at 255°C±5°C solder bath

Relay must be cooled by air immediately after soldering

Solder by Soldering Iron:

Soldering Iron: 30-60W

Temperature:

Duration:

Maximum 3 sec.

We highly recommend that you confirm your actual solder conditions

 

・All values mentioned in this datasheet are provided under ideal conditions. Please perform the

confirmation test before actual use.

 ・Reflow soldering is prohibited.

 ・Do not use relays in the atmosphere with sulfide gas, chloride gas or nitric oxide. Contact resistance

may increase.

 ・Do not use silicon or silicon-containing product or materials near relays. It may cause contact failure.