Figure 13. Forward voltage drop versus forward current

(low level)

0

1

2

3

4

5

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Tj=25°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Typical values)

Tj=100°C

(Typical values)

I

(A)

FM

V

(V)

FM

Figure 14. Thermal resistance junction to ambient versus

copper surface under each lead (SMB flat, SMB flat

Notch)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a)(°C/W)

SMB flat

SMB flat Notch

SCu(cm²)

Epoxy printed board FR4, copper thickness: 35 μm

Figure 15. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

Figure 16. Thermal resistance versus lead length (DO-15)

R (°C/W)

th

0

20

40

60

80

100

120

5

10

15

20

25

Rth(j-a)

Rth(j-I)

L

(mm)

leads

Figure 17. Thermal resistance versus lead length

0

10

20

30

40

50

60

70

80

90

5

10

15

20

25

Rth(°C/W)

R th(j

-

a)

Rth(j-l)

DO-201AD

L leads (mm)

STPS3L60

Characteristics (curves)

DS2134 - Rev 7

page 6/17