3

OPA172, OPA2172, OPA4172

www.ti.com

SBOS618I – DECEMBER 2013 – REVISED MAY 2018

Product Folder Links: OPA172 OPA2172 OPA4172

Submit Documentation Feedback

Copyright © 2013–2018, Texas Instruments Incorporated

Changes from Revision D (September 2014) to Revision E

Page

•

Changed OPA2172 D package from product preview to production data ............................................................................. 1

•

Changed Device Information table ......................................................................................................................................... 1

•

Changed Device Comparison table note (1) to show preview packages............................................................................... 4

•

Changed Handling Ratings table to ESD Ratings table ......................................................................................................... 7

Changes from Revision C (July 2014) to Revision D

Page

•

Changed low-noise features bullet value from 6 nV/

√Hz to 7 ................................................................................................ 1

•

Changed MSOP to VSSOP in features bullet ........................................................................................................................ 1

•

Added packages and new note 2 to Device Information table ............................................................................................... 1

•

Changed OPAx172 voltage noise density from 6 nV/

√Hz to 7 in Device Family Comparison table ..................................... 4

•

Changed OPA4172 package from DGK to PW in Pin Functions table .................................................................................. 6

•

Added OPA2172 Thermal Information table........................................................................................................................... 8

•

Changed input voltage noise value in Electrical Characteristics from 1.2 µVPP to 2.5 µVPP .................................................. 9

•

Changed input voltage noise density value at 100 Hz in Electrical Characteristics from 8.6 nV/

√Hz to 12 .......................... 9

•

Changed input voltage noise density value at 1 kHz in Electrical Characteristics from 6 nV/

√Hz to 7.................................. 9

•

Changed voltage output swing values in the Electrical Characteristics ............................................................................... 10

•

Changed Figure 13 .............................................................................................................................................................. 13

•

Changed Figure 14 ............................................................................................................................................................... 13

•

Added new note to Applications and Implementation section ............................................................................................. 25

Changes from Revision B (May 2014) to Revision C

Page

•

Changed OPA4172 D package (SOIC-14) from product preview to production data ............................................................ 1

•

Added OPA4172-D Thermal information ............................................................................................................................... 8

•

Added Channel separation parameter to the Electrical Characteristics ................................................................................. 9

•

Added Channel Separation vs Frequency plot .................................................................................................................... 17

Changes from Revision A (April 2014) to Revision B

Page

•

Changed DCK (SC70) package from product preview to production data............................................................................. 1

Changes from Original (December 2013) to Revision A

Page

•

Changed document format to meet latest data sheet standards; added Handling Ratings Recommended Operating

Conditions, and Device and Documentation Support sections, and moved existing sections ............................................... 1

•

Changed DCK package pin names from IN+ and IN– to +IN and –IN, respectively ............................................................. 5

•

Changed DBV package from product preview to production data ......................................................................................... 5

•

Changed Figure 9 ................................................................................................................................................................. 12

•

Added Functional Block Diagram section............................................................................................................................. 19

•

Added Capacitive Load Drive Solution Using an Isolation Resistor section ........................................................................ 25

•

Added Power-Supply Recommendations section ................................................................................................................ 28

•

Changed Layout Guidelines section..................................................................................................................................... 29