STPS30L60C

Characteristics

Doc ID 6479 Rev 10

5/13

Figure 12.

Reverse safe operating area (tp < 1 µs, Tj < 150 °C)

Figure 10.

Forward voltage drop versus

forward current

(maximum values, per diode)

Figure 11.

Thermal resistance junction to

ambient versus copper surface

under tab for D2PAK

0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50

1

10

100

200

I

(A)

FM

Tj=25°C

Tj=125°C

Typical values

Tj=150°C

V

(V)

FM

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

S(cm²)

R

(°C/W)

th(j-a)

Epoxy printed circuit board

copper thickness = 35 µm

IARM (A)

VARM (V)

Operating area

Forbidden area

20

22

24

26

28

30

32

34

36

38

40

60

65

70

75

80

85

90