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ICS841S02BGILF 데이터시트(PDF) 11 Page - Integrated Device Technology |
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ICS841S02BGILF 데이터시트(HTML) 11 Page - Integrated Device Technology |
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11 / 17 page ![]() IDT™ / ICS™ PCI EXPRESS CLOCK GENERATOR 11 ICS841S02BGI REV. C NOVEMBER 1, 2007 ICS841S02I PCI EXPRESS™ CLOCK GENERATOR PRELIMINARY APPLICATION INFORMATION POWER SUPPLY FILTERING TECHNIQUES As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS841S02I provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. V DD_SRC, VDDA and VDD_REF should be individually connected to the power supply plane through vias, and 0.01µF bypass capacitors should be used for each pin. Figure 1 illustrates this for a generic V DD_SRC pin and also shows that V DDA requires that an additional10Ω resistor along with a 10µF bypass capacitor be connected to the V DDA pin. FIGURE 1. POWER SUPPLY FILTERING 10 Ω V DDA 10 μF .01 μF 3.3V .01 μF V DD USING THE ON-BOARD CRYSTAL OSCILLATOR The ICS841S02I features a fully integrated Pierce oscillator to minimize system implementation costs. The recommended operation of the ICS841S02I is with a 25MHz, 18pF parallel resonant crystal. See Table 7 for complete crystal specifications. For proper operation, a minimum of 10pF capacitance on each crystal pin is required. The capacitor values shown in Figure 2 TABLE 7. RECOMMENDED CRYSTAL SPECIFICATIONS r e t e m a r a Pe u l a V t u C l a t s y r Ct u C T A l a t n e m a d n u F e c n a n o s e Re c n a n o s e R l e ll a r a P C ( e c n a t i c a p a C t n u h S L)F p 7 - 5 C ( e c n a t i c a p a C d a o L O)F p 8 1 ) R S E ( e c n a t s i s e R s e i r e S t n e l a v i u q E0 5 - 0 2 Ω FIGURE 2. CRYSTAL OSCILLATOR WITH TRIM CAPACITOR XT AL_IN XTAL_OUT 25MHz TBD TBD 33pF 18pF are typical values for the recommended crystal as show in Table 7. The specific values may be adjusted to trim the frequency for the individual board layouts if desired. The crystal and optional trim capacitors should be located as close to the ICS841S02I XTAL_IN and XTAL_OUT pins as possible to minimize board level parasitics. |
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