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L99PM60J 데이터시트(PDF) 68 Page - STMicroelectronics |
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L99PM60J 데이터시트(HTML) 68 Page - STMicroelectronics |
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68 / 75 page ![]() Package and PCB thermal data L99PM60J 68/75 Doc ID 18309 Rev 6 8 Package and PCB thermal data 8.1 PowerSSO-16 thermal data Figure 25. Thermal data of PowerSSO-16 Note: Board finish thickness 1.6 mm +/- 10%; Board double layer; Board dimension 77 x 86; Board Material FR4; Cu thickness 0.070 mm (front and back side); Thermal vias separation 1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm; Footprint dimension 2.5 mm x 4.2 mm Figure 26. Rthj-amb vs PCB copper area in open box free air condition |
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