Figure 7. Forward voltage drop versus forward current

I

(A)

FM

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

V

( V)

FM

T =125°C

(maximum values)

j

T =125°C

(typical values)

j

T =25°C

(maximum values)

j

Figure 8. Thermal resistance junction to ambient versus

copper surface under each lead (SMA)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Rth(j-a) (°C/W)

Epoxy printed circuit copper thickness = 35 µm

STPS1150-Y

Characteristics (curves)

DS7258 - Rev 3

page 4/9