SN74LVC1G00

SCES212AB – APRIL 1999 – REVISED APRIL 2014

www.ti.com

7.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

Operating

1.65

5.5

VCC

Supply voltage

V

Data retention only

1.5

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VIH

High-level input voltage

V

VCC = 3 V to 3.6 V

2

VCC = 4.5 V to 5.5 V

0.7 × VCC

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VIL

Low-level input voltage

V

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

VCC = 1.65 V

–4

VCC = 2.3 V

–8

IOH

High-level output current

–16

mA

VCC = 3 V

–24

VCC = 4.5 V

–32

VCC = 1.65 V

4

VCC = 2.3 V

8

IOL

Low-level output current

16

mA

VCC = 3 V

24

VCC = 4.5 V

32

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

20

Δt/Δv

Input transition rise or fall rate

VCC = 3.3 V ± 0.3 V

10

ns/V

VCC = 5 V ± 0.5 V

5

TA

Operating free-air temperature

–40

125

°C

(1)

All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

7.4 Thermal Information

SN74LVC1G00

THERMAL METRIC(1)

DBV

DCK

DRL

DRY

YZP

DPW

UNIT

5 PINS

5 PINS

5 PINS

6 PINS

5 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

229

278

243

439

130

340

RθJC(top)

Junction-to-case (top) thermal resistance

164

93

78

277

54

215

RθJB

Junction-to-board thermal resistance

62

65

78

271

51

294

°C/W

ψJT

Junction-to-top characterization parameter

44

2

10

84

1

41

ψJB

Junction-to-board characterization parameter

62

64

77

271

50

294

RθJC(bot)

Junction-to-case (bottom) thermal resistance

–

–

–

–

–

250

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

Submit Documentation Feedback

Copyright © 1999–2014, Texas Instruments Incorporated

Product Folder Links: SN74LVC1G00