TL331LVDBVR datasheet(6/71 Pages) TI2

6 / 71 page

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (GND)

–0.3

Input pins (IN+, IN–) from GND

–0.3

Current into Input pins (IN+, IN–)

–10

Output (OUT) from GND

–0.3

Output short circuit duration

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage: VS = (V+) – (GND)

1.65

5.5

Input voltage range (IN+, IN–) from (GND)

–0.1

5.6

Ambient temperature, TA

–40

125

°C

5.4 Thermal Information for TL3x1LV

THERMAL METRIC (1)

TL3x1LV

UNIT

DBV

(SOT-23)

5 PINS

RqJA

Junction-to-ambient thermal resistance

223.7

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

123.2

°C/W

RqJB

Junction-to-board thermal resistance

91.4

°C/W

yJT

Junction-to-top characterization parameter

58.7

°C/W

yJB

Junction-to-board characterization parameter

91.0

°C/W

RqJC(bot)

Junction-to-case (bottom) thermal resistance

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TL331LV, TL391LV, LM393LV, LM339LV

SNOSDA4D – JUNE 2020 – REVISED NOVEMBER 2023

www.ti.com

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Product Folder Links: TL331LV TL391LV LM393LV LM339LV

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