INx

OUTx

GND

ENx

½

TLV751P

V

OUT

V

IN

FBx

C

IN

C

OUT

V

EN

R

2

R

1

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV751

SBVS385B – DECEMBER 2019 – REVISED APRIL 2020

TLV751 Dual, 500-mA, High-Accuracy, LDO in a Small-Size Package

1

1 Features

1

•

Input voltage range: 1.5 V to 6.0 V

•

Output voltage range:

–

Adjustable option: 0.55 V to 5.5 V

–

Fixed option: 0.65 V to 5.0 V

•

Low dropout:

–

130 mV (max) at 500 mA (3.3 VOUT)

•

High output accuracy: 1.5% (maximum over

temperature)

•

IQ: 25 µA (typical)

•

Built-in soft-start with monotonic VOUT rise

•

Package:

–

2-mm × 2-mm WSON-10 (DSQ)

•

Active output discharge

2 Applications

•

Microservers and tower servers

•

Door and window sensors

•

Portable point-of-sale (EPOS)

•

Wearable fitness and activity monitors

•

Scanners

•

Wi-Fi access points

•

Communication modules

3 Description

The TLV751 is a dual, adjustable, 500-mA low-

dropout (LDO) regulator. This device is available in a

small, 10-pin, 2-mm × 2-mm WSON package and

consumes 25-µA quiescent current while providing

fast line and load transient response. The TLV751

features an low dropout of 130 mV that can help

improve the overall power efficiency.

The TLV751 wide input-and-output voltage ranges,

when combined with its output current capability in a

small printed circuit board (PCB) footprint help

support a wide variety of applications from sensor

supplies,

to

auxiliary

rails,

and

modern

microcontrollers with lower core voltages.

The TLV751 is stable with small ceramic output

capacitors, allowing for a small overall solution size.

A precision band-gap and error amplifier provides

high accuracy of 1.5% (max) over temperature. This

device includes integrated thermal shutdown, current

limit,

active

output-discharge,

and

undervoltage

lockout (UVLO) features. The TLV751 has an internal

fold-back current-limit to reduce thermal dissipation

during short-circuit events.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

TLV751

WSON (10)

2.00 mm × 2.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

(2) Preview device.

Typical Application