2/2

USER NOTES

Thermal Characteristics

Worst case power dissipation at full load is less than

5W.

To operate the device at an ambient temperature of

60

°C the thermal resistance case-to-ambient must

be lower than 6.5

°C/W.

This can be accomplished by adding an external

heatsink or by forced ventilation with air speed of

about 100 linear feet/minute.

MTBF Calculations

The MTBF according to MIL HDBK-217E calcula-

tion for a ground benign environment is:

- 216k hours for a case temperature of 91

°C.

- 379k hours for a case temperature of 60

°C.

°C

and forced ventilation of 100 feet/minute.

2 (0.08)

50.8 (2.0)

50.8

(2.0)

Bottom

View

2.54 (0.1)

5.08 (0.20)

43.18 (1.70)

10.16 (0.40)

10.16 (0.40)

14.7

(0.58)

<5 (0.2)

1 (0.04)

1

23

4

5

1 = + Vin

2 = - Vin

3 = Case

4 = - Vout

5 = + Vout

Package G. Dimensions in mm (inches)

CONNECTION DIAGRAM AND MECHANICAL DATA

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the

consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No

license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specification mentioned

in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.

SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express

written approval of SGS-THOMSON Microelectronics.

© 1994 SGS-THOMSON Microelectronics – All Rights Reserved

SGS-THOMSON Microelectronics GROUP OF COMPANIES

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GS15T5-5.2