6

UCC28056

SLUSD37E – OCTOBER 2017 – REVISED NOVEMBER 2019

www.ti.com

Product Folder Links: UCC28056

Submit Documentation Feedback

Copyright © 2017–2019, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage

VCC

-0.5

36

V

ZCD/CS

-0.5

7

VOSNS

-0.5

7

Output voltage

COMP

-0.5

7

V

DRV

-0.3

20

Junction

temperature

range

TJ

-40

150

°C

Storage

temperature

range, Tstg

Tstg

-65

150

Lead temperature

Soldering, 10 second

300

Reflow

260

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per

JEDEC specification JESD22-C101, all

pins(2)

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Input voltage

12

V

TA

Operating ambient temperature

-40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

THERMAL METRIC(1)

UCC28056

UNIT

SOT23-6

6 PINS

RΘJA

Junction-to-ambient thermal resistance

116.4

°C/W

RΘJC(top)

Junction-to-case (top) thermal resistance

74.9

°C/W

RΘJB

Junction-to-board thermal resistance

36.1

°C/W

ΨJT

Junction-to-top characterization parameter

18.8

°C/W

ΨJB

Junction-to-board characterization parameter

36.0

°C/W