STPS30150C

Characteristics

DocID7757 Rev 9

5/16

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

SCu(cm²)

Rth(j-a) (°C/W)

Epoxy printed board FR4, eCU= 35 µm

Figure 7: Junction capacitance versus reverse

voltage applied (typical values, per diode)

Figure 8: Forward voltage drop versus forward

current (per diode)

Figure 9: Thermal resistance junction to ambient versus copper surface under tab for D²PAK

(typical values)

1

2

5

10

20

50

100

200

10

100

1000

C(pF)

V (V)

R

F=1MHz

V

=30mV

T =25°C

OS C

RMS

j

0.1

1.0

10.0

100.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

V

(V)

F

T =25°C

(maxi mum values)

j

T =125°C

(maxi mum values)

j

T =125°C

(typical values)

j

IF (A)