Figure 9. Junction capacitance versus reverse voltage

applied (typical values)

10

100

1000

0.1

1.0

10.0

100.0

C(pF)

VR(V)

F = 1 MHz

VOSC = 30 mVRMS

Tj = 25 °C

Figure 10. Forward voltage drop versus forward current

(typical values)

0.1

1.0

10.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

IF(A)

VF(V)

Tj = 125 °C

Tj = 75 °C

Tj = 150 °C

Tj = 25 °C

Figure 11. Thermal resistance junction to ambient versus

copper surface under each lead (typical values, epoxy

printed board FR4, eCu= 70 µm)

0

30

60

90

120

150

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a)(°C/W)

SOD128flat

SCu(cm²)

Epoxy printed board FR4, copper thickness: 70 μm

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead (typical values, epoxy

printed board FR4, eCu= 70 µm)

0

30

60

90

120

150

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a)(°C/W)

SMB-Flat

SCu(cm²)

Epoxy printed board FR4, copper thickness: 70 μm

Figure 13. Thermal resistance junction to ambient versus copper surface under tab (typical values, epoxy

printed board FR4, eCu= 70 µm)

0

20

40

60

80

100

120

0

1

2

3

4

5

6

7

8

9

10

SCu(cm²)

Rth(j-a) (°C/W)

PSMC (TO-277A)

Epoxy printed board FR4, copper thickness: 70 μm

STPST5H100

Characteristics (curves)

DS14182 - Rev 3

page 5/14