Extruded

Heat Sinks

All other products, please contact factory for price, delivery, and minimums.

Normally stocked

53

EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS

465 AND 476 SERIES

High-Power Heat Sinks for Medium Hex-Type Rectifiers and Diodes

Stud-Mount

Wakefield Engineering has designed four standard heat sink types for ease of installation and

efficient heat dissipation for industry standard hex-type rectifiers and similar stud-mount

power devices: 465, 476, 486, and 489 Series. The 465 and 476 Series shown here are

designed for 1.060 in. Hex (465 Type) and 1.250 in. Hex (476 Type). The 476W Type is avail-

able predrilled for an 0.765 in. (19.4) dia, mounting hole, Material: Aluminum Alloy, Black

anodized.

Nominal Dimensions

Standard

Width

Length

Height

Hex Style

Mounting

Thermal Performance at Typical Load

Weight

P/N

in. (mm)

in. (mm)

in. (mm)

Type

Hole Pattern

Natural Convection

Forced Convection

lbs. (grams)

465K

4.000 (101.6)

5.000 (127.0)

4.000 (101.6)

1.060 in. Hex

None

38°C @ 5OW

0.27°C/W @500 LFM

1.9300 (875.45)

476K

5.000 (127.0)

6.000 (152.4)

5.000 (127.0)

1.250 in. Hex

None

25°C @ 5OW

0.19°C/W @500 LFM

2.8200(1279.15)

476W

5.000 (127.0)

6.000 (152.4)

5.000 (127.0)

1.250 in. Hex

0.765 in.

25°C @ 5OW

0.19°C/W @500 LFM

2.8000(1270.08)

(19.4)Dia.

Center Mount

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

SEMICONDUCTOR

MOUNTING HOLES

K

W

476 SERIES (EXTRUSION

PROFILE 1245)

465 SERIES (EXTRUSION

PROFILE 1244)

486 AND 489 SERIES

Heat Sinks for High-Power Hex-Type Rectifiers and Diodes

Stud-Mount

Nominal Dimensions

Standard

Width

Length

Height

Hex Style

Mounting

Thermal Performance at Typical Load

Weight

P/N

in. (mm)

in. (mm)

in. (mm)

Type

Hole Pattern

Natural Convection

Forced Convection

lbs. (grams)

486K

6.250 (158.8)

6.000 (152.4)

6.250 (158.8)

1.750 in. Hex

None

24° C @ 50W

0.20° C/W @250 LFM

4.2100 (1909.66)

86° C @ 250W

0.13° C/W @500 LFM

489K

6.250 (158.8)

9.000 (228.6)

6.250 (158.8)

1.750 in. Hex

None

19° C @ 50W

0.15° C/W @250 LFM

6.1400 (2785.10)

75° C @ 250W

0.10° C/W @500 LFM

These two heat sink types accept industry standard 1.750 in. (44.5) hex-type devices for

mounting and efficient heat dissipation. Each type is provided with a 1.750 in. (44.5) x 2.000

in. (50.8) area on the semiconductor base mounting surface which is free of anodize.

Material: Aluminum Alloy, Black Anodized.

NATURAL AND FORCED

CONVECTION CHARACTERISTICS

K

SEMICONDUCTOR

MOUNTING HOLE

MECHANICAL DIMENSIONS

486 AND 489 SERIES

(EXTRUSION

PROFILE 1541)

Dimensions: in. (mm)

Dimensions: in. (mm)

MECHANICAL DIMENSIONS

SERIES

486

489