4

THVD1500

SLLSEY4A – JULY 2017 – REVISED NOVEMBER 2018

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Copyright © 2017–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

VCC

–0.5

7

V

Bus voltage

Range at any bus pin (A or B)

–18

18

V

Input voltage

Range at any logic pin (D, DE, or RE)

–0.3

5.7

V

Transient pulse voltage range at any bus pin

(A or B) through 100 Ω

–100

100

Receiver output current

IO

–24

24

mA

Junction temperature

170

°C

Absolute ambient temperature, TA

–55

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Contact Discharge, per IEC 61000-4-2

Pins Bus terminals and

GND

±8,000

V

Air Gap Discharge, per IEC 61000-4-2

Pins Bus terminals and

GND

±10,000

Human-body model (HBM), per

ANSI/ESDA/JEDEC JS-001(1)

Pins Bus terminals and

GND

±16,000

All pins except Bus

terminals and GND

±4,000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1,500

Machine model (MM), per JEDEC JESD22-A115-A

±400

V(EFT)

Electrical fast transient

Per IEC 61000-4-4

Pins Bus terminals

±2,000

V