Figure 5. Relative variation of thermal impedance junction

to case versus pulse duration

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-05

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

tp (s)

Single pulse

Zth(j-c)/Rth(j-c)

Figure 6. Non-repetitive peak surge forward current

versus pulse duration (sinusoidal waveform)

1.E+02

1.E+03

1.E-05

1.E-04

1.E-03

1.E-02

tp(s)

Ta= 25 °C

Ta= 150 °C

IFSM(A)

Figure 7. Total capacitive charges versus reverse voltage

applied (typical values)

0

20

40

60

80

100

120

140

0

100

200

300

400

500

600

700

800

VR(V)

Qcj(nC)

Figure 8. Thermal resistance junction to ambient versus

copper surface under tab (typical values, epoxy printed

board FR4, eCu = 70 μm)

0

10

20

30

40

50

60

0

5

10

15

20

25

30

35

40

Rth(j-a) (°C/W)

D²PAK / D²PAK HV

Epoxy printed board FR4, copper thickness = 70 µm

SCu(cm²)

STPSC20H12-Y

Characteristics (curves)

DS11830 - Rev 4

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