TL084MFKB datasheet(11/78 Pages) TI2

11 / 78 page

5.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TL084xx

UNIT

(SOIC)

DYY

(SOT-23)

(TSSOP)

14 PINS

20 PINS

14 PINS

RθJA

Junction-to-ambient thermal

resistance

114.2

153.2

–

128.8

°C/W

Rθ

JC(top)

Junction-to-case (top) thermal

resistance

70.3

88.7

5.61

14.5

–

14.5

56.1

°C/W

RθJB

Junction-to-board thermal

resistance

70.2

65.4

–

127.6

°C/W

ψJT

Junction-to-top

characterization parameter

28.8

9.5

–

°C/W

ψJB

Junction-to-board

characterization parameter

69.8

65.0

–

106.1

°C/W

Rθ

JC(bot)

Junction-to-case (bottom)

thermal resistance

N/A

–

0.5

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metric application report.

www.ti.com

TL081, TL081A, TL081B, TL081H

TL082, TL082A, TL082B, TL082H

TL084, TL084A, TL084B, TL084H

SLOS081O – FEBRUARY 1977 – REVISED SEPTEMBER 2025

Submit Document Feedback

Product Folder Links: TL081 TL081A TL081B TL081H TL082 TL082A TL082B TL082H TL084 TL084A TL084B TL084H

TL084MFKB 데이터시트(PDF) 11 Page - Texas Instruments

TL084MFKB 데이터시트(HTML) 11 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78

데이터시트 다운로드

링크 URL