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TLV3541IDBVT 데이터시트(PDF) 22 Page - Texas Instruments

부품명 TLV3541IDBVT
상세설명  TLV354x 200-MHz, Rail-to-Rail I/O, CMOS Operational Amplifiers for Cost-Sensitive Systems
PDF  45 Pages
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제조업체  TI2 [Texas Instruments]
홈페이지  https://www.ti.com
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TLV3541IDBVT 데이터시트(HTML) 22 Page - Texas Instruments

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N/C
±IN
+IN
V±
V+
OUTPUT
N/C
N/C
VS+
GND
VS±
GND
Ground (GND) plane on another layer.
VOUT
VIN
GND
Run the input traces
as far away from
the supply lines
as possible.
Use a low-ESR, ceramic
bypass capacitor.
RF
RG
Place components
close to the device and
to each other to reduce
parasitic errors.
+
VIN
VOUT
RG
RF
(Schematic Representation)
Use a low-ESR,
ceramic bypass
capacitor.
22
TLV3541, TLV3542, TLV3544
SBOS756 – OCTOBER 2016
www.ti.com
Product Folder Links: TLV3541 TLV3542 TLV3544
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Copyright © 2016, Texas Instruments Incorporated
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:
•
Noise propagates into analog circuitry through the power pins of the circuit as a whole and the
operational amplifier. Use bypass capacitors to reduce the coupled noise by providing low-impedance
power sources local to the analog circuitry.
–
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
•
Separate grounding for analog and digital portions of the circuitry is one of the simplest and most
effective methods of noise suppression. One or more layers on multilayer PCBs are typically devoted to
ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to
physically separate digital and analog grounds, paying attention to the flow of the ground current.
•
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicularly is much
better than crossing in parallel with the noisy trace.
•
Place the external components as close to the device as possible. Keep RF and RG close to the inverting
input to minimize parasitic capacitance, as shown in Figure 33.
•
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
•
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly
reduce leakage currents from nearby traces that are at different potentials.
10.2 Layout Example
Figure 33. Operational Amplifier Board Layout for Noninverting Configuration



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