TMUX7308FRRPR datasheet(4/54 Pages) TI2

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GND

VSS

VDD

S1A

S1B

S2A

S2B

S3A

S3B

S4A

S4B

Not to scale

Figure 6-3. PW Package, 16-Pin TSSOP (Top View)

VSS

VDD

S1A

S1B

S2A

S2B

S3A

S3B

Not to scale

Thermal

Pad

Figure 6-4. RRP Package, 16-Pin WQFN (Top View)

Table 6-2. Pin Functions: TMUX7309F

TYPE(1)

DESCRIPTION

NAME

TSSOP

WQFN

Logic control input address 0 (A0), has internal 4 MΩ pull-down resistor. Controls switch state

as shown in Section 9.4.3.

Active high logic enable (EN) pin, has internal 4 MΩ pull-down resistor. The device is disabled

and all switches become high impedance when the pin is low. When the pin is high, the Ax

logic inputs determine individual switch states as shown in Section 9.4.3.

VSS

Negative power supply. This pin is the most negative power-supply potential. In single-supply

applications, this pin can be connected to ground. For reliable operation, connect a decoupling

capacitor ranging from 0.1 µF to 10 µF between VSS and GND.

S1A

I/O

Overvoltage protected source pin 1A. Can be an input or output.

S2A

I/O

Overvoltage protected source pin 2A. Can be an input or output.

S3A

I/O

Overvoltage protected source pin 3A. Can be an input or output.

S4A

I/O

Overvoltage protected source pin 4A. Can be an input or output.

I/O

Drain terminal A. Can be an input or output. The drain pin is not overvoltage protected.

I/O

Drain terminal B. Can be an input or output. The drain pin is not overvoltage protected.

S4B

I/O

Overvoltage protected source pin 4B. Can be an input or output.

S3B

I/O

Overvoltage protected source pin 3B. Can be an input or output.

S2B

I/O

Overvoltage protected source pin 2B. Can be an input or output.

S1B

I/O

Overvoltage protected source pin 1B. Can be an input or output.

VDD

Positive power supply. This pin is the most positive power-supply potential. For reliable

operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and

GND.

GND

Ground (0 V) reference

Logic control input address 1 (A1), has internal 4 MΩ pull-down resistor. Controls switch state

as shown in Section 9.4.3.

Thermal Pad

The thermal pad is not connected internally. It is recommended that the pad be tied to GND or

VSS for best performance.

(1)

I = input, O = output, I/O = input and output, P = power

TMUX7308F, TMUX7309F

SCDS403C – FEBRUARY 2021 – REVISED JULY 2023

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