ADPL12002/ADPL12003

20V, 2.5A/3.5A, Fully Integrated Synchronous

Buck Converter

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Absolute Maximum Ratings

SUP....................................................................-0.3V to +22V

EN ......................................................................-0.3V to +22V

BST to LX..........................................................-0.3V to +2.2V

BST ....................................................................-0.3V to +24V

LX.............................................................-0.3V to SUP + 0.3V

SYNC ...................................................................-0.3V to +6V

FB ......................................................................-0.3V to +16V

PGOOD................................................................-0.3V to +6V

BIAS ..................................................................-0.3V to +2.2V

SPS ...................................................................-0.3V to +2.2V

PGND to AGND ................................................ -0.3V to +0.3V

LX Continuous RMS current .............................................3.5A

ESD Protection

__Human Body Model ..................................................... ±2kV

__Charged Device Model...............................................±750V

__Continuous Power Dissipation (Multilayer Board) (TA =

+70°C, derate 25mW/°C above +70°C.).................... 2000mW

__Operating Junction Temperature Range .... -40°C to +150°C

__Storage Temperature Range ..................... -65°C to +150°C

__Soldering Temperature (soldering 10s) .................... +300°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

Package Code

F153B3F+1F

Outline Number

21-100701

Land Pattern Number

90-100241

Thermal Resistance, Single-Layer Board:

Junction-to-Ambient (θJA)

40°C/W

Junction-to-Case Thermal Resistance (θJC)

15°C/W

Thermal Resistance, Four-Layer Board:

Junction-to-Ambient (θJA)

51°C/W

Junction-to-Case Thermal Resistance (θJC)

21°C/W

For the latest package outline information and land patterns (footprints), go to https://www.analog.com/en/design-

center/packaging-quality-symbols-footprints/package-index.html. Note that a “+”, “#”, or “-” in the package code indicates

RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package

regardless of RoHS status.

Package thermal resistances were obtained using the evaluation kit, a four-layer board. For detailed information on

package thermal considerations, refer to https://www.analog.com/en/technical-articles/thermal-characterization-of-ic-

packages.html.