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ADRF5238BCRZN-R7 데이터시트(PDF) 6 Page - Analog Devices

부품명 ADRF5238BCRZN-R7
상세설명  High Isolation, Silicon SPDT, Nonreflective Switch, 0.1GHz to 13GHz
PDF  13 Pages
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제조업체  AD [Analog Devices]
홈페이지  http://www.analog.com
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ADRF5238BCRZN-R7 데이터시트(HTML) 6 Page - Analog Devices

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Data Sheet
ADRF5238
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 6 of 13
For recommended operating conditions, see Table 1 and Table 2.
Table 3. Absolute Maximum Ratings
Parameter
Rating
Supply Voltage
−0.3V to +5.8V
Digital Control Inputs1
Voltage
−0.5V to 3.6V
Current
3mA
RF Input Power (VDD = 5V)2, 3
Through Path
Average
36dBm
Peak4
36dBm
Terminated Path
Average
28dBm
Peak
30dBm
Hot Switching (RFC)
Average
34dBm
Peak
34dBm
Hot Switching (RFx)
Average
28dBm
Peak
30dBm
RF Input Power (VDD = 3.3V)
Through Path
Average
34dBm
Peak
34dBm
Terminated Path
Average
27dBm
Peak
29dBm
Hot Switching (RFC)
Average
32dBm
Peak
32dBm
Hot Switching (RFx)
Average
27dBm
Peak
29dBm
RF Power Under Unbiased Condition (VDD = 0V)
18dBm
Temperature
Junction (Tj)
135°C
Storage
−65°C to +150°C
Reflow
260°C
1 Overvoltages at the digital control inputs are clamped by internal diodes.
Current must be limited to the maximum rating given.
2 For power derating over frequency, see Figure 2 and Figure 3.
3 For 105°C operation, the average power handling degrades 3dB, and the peak
power handling degrades 1dB from the TCASE = 85°C specifications.
4 Peak: (≤100 ns pulse duration, 5% duty cycle).
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
Only one absolute maximum rating can be applied at any one time.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
θJC is the junction to case bottom (channel to package bottom)
thermal resistance (see Table 4).
Table 4. Thermal Resistance
Package Type
θJC
Unit
CR-12-1
Through Path
57
°C/W
Terminated Path
100
°C/W
POWER DERATING CURVES
Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C
Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C



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