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MP700294 데이터시트(PDF) 1 Page - Multicomp Pro |
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MP700294 데이터시트(HTML) 1 Page - Multicomp Pro |
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1 / 2 page ![]() Page <1> V1.0 30/06/20 Copper Foil Tapes with Conductive Adhesive Newark.com/multicomp-pro Farnell.com/multicomp-pro Element14.com/multicomp-pro Description This is coated with an acrylic adhesive which is uniformly dispersed with conductive spheres to provide a very low rate of electrical resistance through the tape. Applications • This Copper Foil Tape is typically used as an EMI/RFI shielding tape for applications in the electronics industry such as static charge draining, seaming shielded rooms, cable wrapping and surface contact to non-solderable materials (e.g. aluminium or plastics). Storage Conditions Tape should be stored in a dry area at temperatures of 60°F (16°C) to 80°F (26°C). MP700292 MP700298 Property Characteristic Foil thickness 1.4 mil Adhesive Acrylic (clear) Tape Thickness without Liner 3.2 mil Colour Bright Copper Peel Adhesion (1 min Dwell) (oz/in) 37 Peel Adhesion (24 hr Dwell) (oz/in) 59 Temperature Range -40°F to 248°F Tensile Strength (lb/in) 37 Elongation (%) 6 Surface Preparation The surface to which the tape is applied should be dry, clean, and free of contaminates. MP700294 MP700296 |
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유사한 설명 - MP700294 |
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