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MP700294 데이터시트(PDF) 1 Page - Multicomp Pro

부품명 MP700294
상세설명  Copper Foil Tapes with Conductive Adhesive
PDF  2 Pages
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제조업체  MULTICOMP [Multicomp Pro]
홈페이지  https://www.multicomp-pro.com/
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MP700294 데이터시트(HTML) 1 Page - Multicomp Pro

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V1.0
30/06/20
Copper Foil Tapes with
Conductive Adhesive
Newark.com/multicomp-pro
Farnell.com/multicomp-pro
Element14.com/multicomp-pro
Description
This is coated with an acrylic adhesive which is uniformly dispersed with conductive spheres to provide a very low rate of
electrical resistance through the tape.
Applications
• This Copper Foil Tape is typically used as an EMI/RFI shielding tape for applications in the electronics industry such as
static charge draining, seaming shielded rooms, cable wrapping and surface contact to non-solderable materials (e.g.
aluminium or plastics).
Storage Conditions
Tape should be stored in a dry area at temperatures of 60°F (16°C) to 80°F (26°C).
MP700292
MP700298
Property
Characteristic
Foil thickness
1.4 mil
Adhesive
Acrylic (clear)
Tape Thickness without Liner
3.2 mil
Colour
Bright Copper
Peel Adhesion (1 min Dwell) (oz/in)
37
Peel Adhesion (24 hr Dwell) (oz/in)
59
Temperature Range
-40°F to 248°F
Tensile Strength (lb/in)
37
Elongation (%)
6
Surface Preparation
The surface to which the tape is applied should be dry, clean, and free of contaminates.
MP700294
MP700296


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