12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

12.1 Thermal Information

This PowerPad™ package incorporates an exposed thermal pad that is designed to be directly to an external

heatsink. The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can

be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to

the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to

a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated

circuit (IC).

For additional information on the PowerPAD™ package and how to use the advantage of its heat dissipating

abilities, refer to Technical Brief, PowerPAD™ Thermally Enhanced Package, Texas Instruments Literature No.

SLMA002 and Application Brief, PowerPAD™ Made Easy, Texas Instruments Literature No. SLMA004.

The exposed thermal pad dimensions for this package are shown in the following illustration.

°

2.31

7

1

2.46

14

8

Thermal Pad

Figure 12-1. Thermal Pad Dimensions

TPS54526

SLVSB84D – MAY 2012 – REVISED APRIL 2021

www.ti.com

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