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PACKAGE OUTLINE

C

28X

-.021

.013

-0.53

0.33

[

]

28X

-.032

.026

-0.81

0.66

[

]

TYP

-.495

.485

-12.57

12.32

[

]

24X .050

[1.27]

-.438

.382

-11.12

9.71

[

]

(.008)

[0.2]

TYP

-.120

.090

-3.04

2.29

[

]

.180 MAX

[4.57]

.020 MIN

[0.51]

B

NOTE 3

-.456

.450

-11.58

11.43

[

]

A

NOTE 3

-.456

.450

-11.58

11.43

[

]

4215153/B 05/2017

4215153/B 05/2017

PLCC - 4.57 mm max height

FN0028A

PLASTIC CHIP CARRIER

NOTES:

1. All linear dimensions are in inches. Any dimensions in brackets are in millimeters. Any dimensions in parenthesis are for reference only.

Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Dimension does not include mold protrusion. Maximum allowable mold protrusion .01 in [0.25 mm] per side.

4. Reference JEDEC registration MS-018.

PIN 1 ID

(OPTIONAL)

1

28

4

12

18

19

25

5

11

.004 [0.1] C

.007 [0.18]

C A B

SEATING PLANE

SCALE 1.000