US79 Series

CMOS Power Hall IC

39010US79

Page 7 of 9

DataSheet

Rev. 006

Feb/04

10.

Reliability Information

This Melexis device is classified and qualified regarding soldering technology, solderability and moisture

sensitivity level, as defined in this specification, according to following test methods:

•

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

•

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

•

CECC00802

Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed

Quality

•

EIA/JEDEC JESD22-B106

Resistance to soldering temperature for through-hole mounted devices

•

EN60749-15

Resistance to soldering temperature for through-hole mounted devices

•

MIL 883 Method 2003 / EIA/JEDEC JESD22-B102

Solderability

For all soldering technologies deviating from above mentioned standard conditions (regarding peak

temperature, temperature gradient, temperature profile etc) additional classification and qualification tests

have to be agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance

of adhesive strength between device and board.

Based on Melexis commitment to environmental responsibility, European legislation (Directive on the

Restriction of the Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has

installed a Roadmap to qualify their package families for lead free processes also.

Various lead free generic qualifications are running, current results on request.

For more information on manufacturability/solderability see quality page at our website:

http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf

11.

ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor products.