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RF3166SB 데이터시트(PDF) 9 Page - RF Micro Devices

부품명 RF3166SB
상세설명  QUAD-BAND GSM850/GSM900/DCS/PCS POWER AMP MODULE
PDF  16 Pages
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제조업체  RFMD [RF Micro Devices]
홈페이지  http://www.rfmd.com
Logo RFMD - RF Micro Devices

RF3166SB 데이터시트(HTML) 9 Page - RF Micro Devices

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RF3166
Rev A3 DS061031
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Application Schematic
Evaluation Board Schematic
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
DCS/PCS IN
BAND SELECT
TX ENABLE
VBATT
VRAMP
GSM IN
DCS/PCS OUT
GSM OUT
9
1
3
2
6
5
4
8
7
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
50
Ω μstrip
BAND SELECT
TX ENABLE
VBATT
VRAMP
22
μF*
Notes:
* The value of the VBATT decoupling capacitor depends on the noise level of the phone board.
Capacitor type may be either tantalum or ceramic. Some applications may not require this capacitor.
1. All the PA output measurements are referenced to the PA output pad (pins 8 and 9).
2. The 50
Ω μstrip between the PA output pad and the SMA connector has an approximate insertion loss
of 0.1 dB for GSM850/EGSM900 and 0.2 dB for DCS1800/PCS1900 bands.
GND
P1
1
CON1
DCS/PCS IN
GSM IN
DCS/PCS OUT
GSM OUT
VCC
P2
1
CON1
P2-1
9
1
3
2
6
5
4
8
7



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