3 of 12
RF2163
Rev A6 DS060301
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Pin
Function
Description
Interface Schematic
1GND
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
2RF IN
RF input. This input is AC coupled, so an external blocking capacitor is not
required if this pin is connected to a DC path.
3BIAS GND2
Ground for second stage bias circuit. For best performance, keep traces
physically short and connect immediately to ground plane.
See pin 16.
4PWR SEN
The PWR SEN and PWR REF pins can be used in conjunction with an exter-
nal feedback path to provide an RF power control function for the RF2163.
The power control function is based on sampling the RF drive to the final
stage of the RF2163.
5PWR REF
Same as pin 4.
See pin 4.
6VREG1
This pin requires a regulated supply to maintain the correct bias current.
See pin 16.
7VREG2
Same as pin 6.
See pin 16.
8BIAS GND1
Ground for first stage bias circuit. For best performance connect to ground
with a 10nH inductor.
See pin 16.
9GND
Same as pin 1.
10
RF OUT
RF output and bias for the output stage. The power supply for the output
transistor needs to be supplied to this pin. This can be done through a
quarter-wave length microstrip line that is RF grounded at the other end, or
through an RF inductor that supports the required DC currents.
11
RF OUT
Same as pin 10.
See pin 10.
12
RF OUT
Same as pin 10.
See pin 10.
13
NC
Not connected.
14
VCC1
Interstage match and bias for first stage output. Connect interstage match-
ing capacitor to t pin with a short trace. Connect low-frequency bypass
capacitors to this pin with a long trace. See evaluation board layout for
details.
See pin 2.
15
VCC1
Same as pin 14.
See pin 2.
16
VCC
Power supply pin for the bias circuits. External low frequency bypass capac-
itors should be connected if no other low frequency decoupling is nearby.
Pkg
Base
GND
Ground connection. The backside of the package should be connected to
the ground plane through a short path, i.e., vias under the device may be
required.
See pin 1 and 2.
RF IN
VCC1
Bond Wire
Inductance
BIAS
RF OUT
PWR SEN
PWR REF
BIAS
RF OUT
BIAS
BIAS
VREG1
VREG2
BIAS
GND1
BIAS
GND2
VCC
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