| 전자부품 데이터시트 검색엔진 |
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LM4863 데이터시트(PDF) 6 Page - National Semiconductor (TI) |
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LM4863 데이터시트(HTML) 6 Page - National Semiconductor (TI) |
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6 / 21 page ![]() Typical Performance Characteristics MTE Specific Characteristics (Continued) LM4863MTE (Note 17) Power Derating Curve 01288137 Note 17: This curve shows the LM4863MTE’s thermal dissipation ability at different ambient temperatures given these conditions: 500LFPM + JEDEC board: The part is soldered to a 1S2P 20-lead exposed-DAP TSSOP test board with 500 linear feet per minute of forced-air flow across it. Board information - copper dimensions: 74x74mm, copper coverage: 100% (buried layer) and 12% (top/bottom layers), 16 vias under the exposed-DAP. 500LFPM + 2.5in2: The part is soldered to a 2.5in2, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it. 2.5in2: The part is soldered to a 2.5in2, 1oz. copper plane. Not Attached: The part is not soldered down and is not forced-air cooled. Non-MTE Specific Characteristics THD+N vs Frequency THD+N vs Frequency 01288103 01288104 THD+N vs Frequency THD+N vs Output Power 01288105 01288106 www.national.com 6 |
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