L6223 datasheet(26/33 Pages) STMICROELECTRONICS

26 / 33 page

Matching the L6223 with the motor.

For the correct design of the application the fol-

lowing notes must be considered.

* For low motor resistance and high supply volt-

age the L6223 minimum duty cycle may limit

the minimum current at a value higher than re-

quested.

In this case we suggest to reduce the window

protection time changing the RC oscillator net-

work. (See Fig. 21a and External RC Network).

* Only in single device application, for very low

motor resistance, a large current imbalance

may affect the correct motor rotation. Motor re-

sistance value higher than 7 Ohm are generally

recommended for 35V Power Supply.

* The correct motor winding execution is very im-

portant for the motor and the L6223 efficiency.

A simple test is the measurement of the stray

inductance between the central tap and the

ends shorted together of each winding. Theo-

retically the inductance would be zero; values

higher than 50

µH may show poor motor quality.

Computer Aided Development Board

An improvement in the application development

and in system debugging can be obtained by

means of the Personal Computer.

Interfacing the appliction with the PC, the motor

can be driven directly by this in real time opera-

tion. This permits the testing in very short time

and a lot of different motion configurations, during

application debugging and optimization. More-

over, by paralleling more application boards, an

efficient reliability test can be implemented.

The development board designed to drive L6223

in Single and Dual Device configuration is shown

in Fig. 32a-b. Fig. 33 is the corresponding electri-

cal circuit. On the board are mounted three

L6223: two for the Dual Device configuration and

one for the Single Device. The three connectors

J1, J2, J3 allow the application board to be inter-

faced with the PC and to be paralleled with an-

other one. The remaining connectors provide the

interface with the motor and the power and logic

supply. The ground area has been sized to act as

heatsink (35 micron thickness). When the copper

area is not sufficient to dissipate the heat an ex-

ternal heatsink is required.

L6223

26/33

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