AD8139

Rev. B | Page 7 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

12 V

Power Dissipation

See Figure 4

Input Common-Mode Voltage

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

specified for device soldered in circuit board for surface-mount

packages.

Table 4.

Package Type

Unit

8-Lead SOIC with EP/4-Layer

70

°C/W

8-Lead LFCSP/4-Layer

70

°C/W

Maximum Power Dissipation

The maximum safe power dissipation in the AD8139 package

the die. At approximately 150°C, which is the glass transition

temperature, the plastic will change its properties. Even

temporarily exceeding this temperature limit can change the

stresses that the package exerts on the die, permanently shifting

the parametric performance of the AD8139. Exceeding a junction

temperature of 175°C for an extended period can result in

changes in the silicon devices potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

and common-mode currents flowing to the load, as well as

currents flowing through the external feedback networks and

the internal common-mode feedback loop. The internal resistor

tap used in the common-mode feedback loop places a 1 kΩ

differential load on the output. RMS output voltages should be

considered when dealing with ac signals.

with the package leads from metal traces, through holes,

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the exposed paddle

are approximations.

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

–40

–20

0

20

40

60

80

100

120

AMBIENT TEMPERATURE (°C)

SOIC

AND LFCSP

Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION