10

FN7058.3

May 1, 2007

FIGURE 37. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE

0.9

0.8

0.6

0.4

0.2

0

0100

AMBIENT TEMPERATURE (°C)

150

25

125

75

50

0.7

0.5

0.3

0.1

85

781mW

607mW

θ

JA =

+16

0°C

/W

θ

JA =

+20

6°C

/W

SO

8

MSO

P8

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

Pin Descriptions

EL2227CY

8-PIN MSOP

EL2227CS

8-PIN SO

PIN NAME

PIN

FUNCTION

EQUIVALENT CIRCUIT

1

1

VOUTA

Output

Circuit 1

2

2

VINA-

Input

Circuit 2

3

3

VINA+

Input

Reference Circuit 2

4

4

VS-

Supply

5

5

VINB+

Input

6

6

VINB-

Input

Reference Circuit 2

7

7

VOUTB

Output

Reference Circuit 1

8

8

VS+

Supply

EL2227