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DA9130 데이터시트(PDF) 11 Page - Renesas Technology Corp |
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DA9130 데이터시트(HTML) 11 Page - Renesas Technology Corp |
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11 / 47 page ![]() DA9130 Datasheet R16DO0058EJ0301 Rev.03.01 July 01, 2025 CFR0011-120-00 Page 11 3.4 Thermal Specifications Table 6: Package Ratings Parameter Description Conditions Min Typ Max Unit JA Package thermal resistance Note 1 21.21 °C/W JB Thermal resistance junction to board Note 1 12.37 °C/W JC Thermal resistance junction to case Without PCB 32 °C/W Note 1 Obtained from package thermal simulations, JEDEC 2S2P four layer board (76.2 mm x 114 mm x 1.6 mm), 70 μm (2 oz) copper thickness power planes, 35 μm (1 oz) copper thickness signal layer traces, natural convection (still air), see section 9. 3.4.1 Power Dissipation Table 7: Power Dissipation Parameter Description Conditions Min Typ Max Unit PD_Twarn Power dissipation @105 °C ambient, TJ_WARN 0.94 W PD_Tcrit Power dissipation @105 °C ambient, TCRIT 1.18 1.65 W Figure 5. Power Derating Curve |
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