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WILCS02UE 데이터시트(PDF) 54 Page - Microchip Technology

부품명 WILCS02UE
상세설명  single chip 2.4 GHz and IEEE 802.11b/g/n-compliant solution
PDF  71 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

WILCS02UE 데이터시트(HTML) 54 Page - Microchip Technology

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WILCS02IC and WILCS02 Family
Packaging Information
 Data Sheet
© 2024-2025 Microchip Technology Inc. and its subsidiaries
DS70005557C - 54
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
5.40
5.40
MILLIMETERS
0.50 BSC
MIN
E
MAX
6.90
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
0.85
0.30
NOM
C1
Contact Pad Spacing
6.90
Contact Pad to Contact Pad (X44)
G2
0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2021 Microchip Technology Inc.
Contact Pad to Center Pad (X48)
G1
0.33
C1
C2
EV
EV
X2
Y2
E
X1
Y1
G1
G2
ØV
SILK SCREEN
48-Lead Very Thin Plastic Quad Flat, No Lead Package (ZZX) - 7x7 mm Body [VQFN]
With 5.3 mm Exposed Pad
Microchip Technology Drawing C04-2535 Rev A



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