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2023-2026 Microchip Technology Inc. and its subsidiaries

DS20005911B-page 13

HV861

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

Y2

X2

1.65

1.65

MILLIMETERS

0.50 BSC

MIN

E

MAX

2.90

Contact Pad Length (X16)

Contact Pad Width (X16)

Y1

X1

0.85

0.30

Microchip Technology Drawing C04-2303A

NOM

16-Lead Very, Very Thin Plastic Quad Flat, No Lead Package (3P) - 3x3 mm Body

SILK SCREEN

1

2

16

C1

C2

E

X1

Y1

G1

Y2

X2

C1

Contact Pad Spacing

2.90

Contact Pad to Center Pad (X16)

G1

0.20

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.30

1.00

ØV

EV

EV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

[WQFN]; Supertex Legacy Package K7

© 2021 Microchip Technology Inc.