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DS20005820B-page 18

 2024-2026 Microchip Technology Inc. and its subsidiaries

Microchip Technology Drawing C04-026-L4X Rev D Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

28-Lead Plastic Leaded Chip Carrier (L4X) - Square [PLCC]

1.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

4. Dimensioning and tolerancing per ASME Y14.5M

3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

2. § Significant Characteristic

protrusions shall not exceed .005" per side.

© 2023 Microchip Technology Inc.

.021

-

.013

b

Lower Lead Width

.032

-

.025

b1

Upper Lead Width

.0125

-

.0075

c

Lead Thickness

.438

.410

.382

D2

Footprint Length

.438

.410

.382

E2

Footprint Width

.456

.453

.450

D1

Molded Package Length

.456

.453

.450

E1

Molded Package Width

.495

.490

.485

D

Overall Length

.495

.490

.485

E

Overall Width

.056

-

.042

CH3

Side Chamfer

.020

-

-

CH2

Chamfers

.048

-

.042

CH1

Corner Chamfer

.020

A3

Standoff

A2

Molded Package to Contact

.180

.172

.165

A

Overall Height

.050

e

Pitch

28

N

Number of Pins

MAX

NOM

MIN

Dimension Limits

INCHES

Units

.062

-

.083

--

Contact Height

A1

.090

.105

.120

§

0.53

-

0.33

0.81

-

0.64

0.32

-

0.19

11.13

10.41

9.70

11.13

10.41

9.70

11.58

11.51

11.43

11.58

11.51

11.43

12.57

12.45

12.32

12.57

12.45

12.32

1.42

-

1.07

0.51

-

-

1.22

-

1.07

0.51

4.57

4.37

4.19

1.27

28

MAX

NOM

MIN

MILLIMETERS

1.57

-

2.11

--

2.29

2.67

3.05