MSC040SMB120SD

Package Specification

 Data Sheet

© 2025 Microchip Technology Inc. and its subsidiaries

DS50004008A - 11

Table 2-2. Recommended Land Pattern Dimensions

Symbol

Description

Min. (mm)

Nom. (mm)

Max. (mm)

E

Contact pitch

1.27 BSC

X2

Center pad width

—

—

8.30

Y2

Center pad length

—

—

8.45

C1

Contact pad spacing

—

6.45

—

C2

Contact pad spacing

—

4.30

—

X1

Contact pad width (X7)

—

—

0.80

Y1

Contact pad length (X7)

—

—

2.90

G1

Contact pad to center pad (X7) 3.88

—

—

G2

Contact pad to contact pad (X6) 0.47

—

—

Notes: 

• Dimensioning and tolerancing per ASME Y14.5M.

– BSC: Basic dimension. Theoretically exact value shown without tolerances.

• For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss

during reflow process.

2.3.

Product Marking Information

The following figure shows the product marking information of this device.

Figure 2-3. Product Marking Information

Marking

Marking Identifier

Description

XXXXXXXXXX Catalog Part Number

(CPN)

This is the unique catalog number for the finished device.

Note: For automotive-grade device, the VAO identifier is not shown.

YYWWNNN Traceability code

A unique identifier assigned by Microchip to track and verify the manufacturing

history of the device.

YYWW

Date code

A four-digit number which reflects the year and work week of manufacturing. It is

the first four digits of the traceability code.

PP

Country of origin

Two-character code per ISO 3166-1-Alpha-2, indicating the manufacturing country.

e3

ROHS category (Lead

finish code)

This code specifies the type of finish applied to the device’s leads.

Note: e3 indicates a 100% Matte Tin (Sn) finish.