MPC7441 datasheet(29/60 Pages) FREESCALE

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MPC7441 데이터시트(PDF) 29 Page - Freescale Semiconductor, Inc

부품명	MPC7441

상세설명	RISC Microprocessor Hardware Specifications

PDF	60 Pages

Scroll/Zoom	100%

제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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29 / 60 page

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

Freescale Semiconductor

Package Description

The following sections provide the package parameters and mechanical dimensions for the HCTE

package.

8.1

Package Parameters for the MPC7448, 360 HCTE BGA

The package parameters are as provided in the following list. The package type is 25

× 25 mm, 360-lead

high coefficient of thermal expansion ceramic ball grid array (HCTE).

Package outline

× 25 mm

Interconnects

360 (19

× 19 ball array – 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.32 mm

Maximum module height

2.80 mm

Ball diameter

0.89 mm (35 mil)

Coefficient of thermal expansion12.3 ppm/°C

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