AD8193

Rev. 0 | Page 16 of 16

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

1

32

8

9

25

24

17

16

2.85

2.70 SQ

2.55

TOP

VIEW

COPLANARITY

0.08

3.50 REF

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.60 MAX

0.20 MIN

*EXPOSED

PAD

(BOT TOM VIEW)

PIN 1

INDICATOR

0.30

0.25

0.18

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

0.50

0.40

0.30

5.00

BSC SQ

4.75

BSC SQ

*THE AD8193 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

THE DEVICE OVER THE FULL HDMI/DVI TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF

THE PACKAGE AND ELECTRICALLY CONNECTED TO AVEE. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES

OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG.

ATTACHING THE SLUG TO AN AVEE PLANE REDUCES THE JUNCTION TEMPERATURE OF THE DEVICE WHICH MAY

BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.

Figure 27. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

AD8193ACPZ1

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-8

AD8193ACPZ-R71

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Reel

CP-32-8

1,500

AD8193-EVALZ1

Evaluation Board

©2007 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D0700

3-0-11/07(0)