LUXEON K2 Datasheet DS51 (7/07)

12

JEDEC Moisture Sensitivity

Table 9.

S

So

oa

ak

k R

Re

eq

qu

uiirre

em

me

en

ntts

s

L

Le

ev

ve

ell

F

Fllo

oo

orr L

Liiffe

e

S

Stta

an

nd

da

arrd

d

A

Ac

cc

ce

elle

erra

atte

ed

d E

En

nv

viirro

on

nm

me

en

ntt

T

Tiim

me

e

C

Co

on

nd

diittiio

on

ns

s

T

Tiim

me

e

C

Co

on

nd

diittiio

on

ns

s

T

Tiim

me

e

C

Co

on

nd

diittiio

on

ns

s

((h

ho

ou

urrs

s))

((h

ho

ou

urrs

s))

2a

4

≤ 30°C /

696

[1]

30°C / 60%

120

60°C / 60%

weeks

60% RH

+ 5/0

RH

+1/0

RH

Notes for Table 9:

1.

The standard soak time includes a default value of 24 hours for semiconductor manufacturer's exposure time (MET)

between bake and bag and includes the maximum time allowed out of the bag at the distributor's facility.

Reflow Soldering Characteristics

Table 10.

P

Prro

offiille

e F

Fe

ea

attu

urre

e

L

Le

ea

ad

d F

Frre

ee

e A

As

ss

se

em

mb

blly

y

3°C / second max

150°C

200°C

60

180 seconds

217°C

60

150 seconds

260°C

20

40 seconds

Ramp

Down Rate

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Notes for Table 10:

1.

All temperatures refer to topside of the package, measured on the package body surface.

JEDEC 020c