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THERMAL CHARACTERISTICS

RECOMMENDED OPERATING CONDITIONS

Device Power

ELECTRICAL CHARACTERISTICS

SN75DP129

SLAS583A – JANUARY 2008 – REVISED MARCH 2008

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Junction-to-board thermal resistance

°C/W

Junction-to-case thermal resistance

24.74

°C/W

PRBS;

380

490

mW

Device power dissipation under low power

LP = 0 V

5

20

µW

(1)

(2)

Termination Supply).

MIN

NOM

MAX

UNIT

Supply voltage

3

3.3

3.6

V

Supply voltage

1.65

3.6

V

Operating free-air temperature

0

85

°C

MAIN LINK DIFFERENTIAL INPUT PINS

Peak-to-peak input differential voltage

0.15

1.40

V

Data rate

2.5

Gbps

TMDS DIFFERENTIAL OUTPUT PINS

TMDS output termination voltage

3

3.3

3.6

V

Data rate

2.5

Gbps

Termination resistance

45

50

55

Ω

Input voltage

0

5.5

V

I2C data rate

100

kHz

HPD AND CONTROL PINS

High-level input voltage

2

5.5

V

Low-level input voltage

0

0.8

V

The SN75DP129 is designed to operate from one or two supply voltages, depending on the implementation of

the integrated Hot Plug Detect (HPD) level translator. The TMDS level translator is powered from a single 3.3-V

supply. The HPD translator is powered using the VDD pin and its voltage can range from 1.8 V to 3.3 V. This

voltage determines the HIGH-level output voltage of the HPD_OUT pin.

over recommended operating conditions (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Supply current

50

75

112

mA

Supply current

1

2

mA

HPD: HPD_IN = 5 V

ISD

Shutdown current

LP = 0 V

1

5

µA

8

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