DATASHEET

Reference Information

Packaging:

Cable Assemblies: Bag

Locking Pin: Bag, vacuum-sealed

UL File No.: E29179

CSA File No.: 70184994

Use With: Printed circuit boards and busbars

Designed In: Millimeters

RoHS: Yes

Halogen Free: Yes

Physical

Receptacle Housing: PBT

Contact: High–performance Copper (Cu) Alloy

Plating:

Socket Contact Area—Gold (Au)

Pin - Silver (Ag)

PCB Thickness (min.): 1.58mm

Busbar Thickness (min.): 1.50mm

Flammability: UL 94V-0

Operating Temperature: -40 to +125°C

Electrical (6.00mm Size)

Voltage (max.): 1,000V

Current (max.): 120.0A

Contact Resistance (max.): 0.25 milliohms

Mechanical (6.00mm Size)

Mating Force (max.): 50N

Unmating Force (min.): 5N

Durability (min.): 200 mating cycles

Electrical (8.00mm Size)

Voltage (max.): 1,000V

Current (max.): 185.0A

Contact Resistance (max.): 0.25 milliohms

Mechanical (8.00mm Size)

Mating Force (max.): 60N

Unmating Force (min.): 6N

Durability (min.): 200 mating cycles

Electrical (11.00mm Size)

Voltage (max.): 1,000V

Current (max.): 300.0A

Contact Resistance (max.): 0.25 milliohms

Mechanical (11.00mm Size)

Mating Force (max.): 70N

Unmating Force (min.): 7N

Durability (min.): 200 mating cycles

SPECIFICATIONS

www.molex.com/link/SW1.html

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.

Order No. 987652-4267 Rev. 1

USA/0k/GF/2023.03

©2023 Molex

SW1 High-Current Wire-to-Board

and Busbar Interconnects