전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

SCF1812 데이터시트(PDF) 3 Page - Socay Electornics Co., Ltd.

부품명 SCF1812
상세설명  Surface Mount Resettable PTCs
PDF  6 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  SOCAY [Socay Electornics Co., Ltd.]
홈페이지  http://www.socay.com
Logo SOCAY - Socay Electornics Co., Ltd.

SCF1812 데이터시트(HTML) 3 Page - Socay Electornics Co., Ltd.

  SCF1812 Datasheet HTML 1Page - Socay Electornics Co., Ltd. SCF1812 Datasheet HTML 2Page - Socay Electornics Co., Ltd. SCF1812 Datasheet HTML 3Page - Socay Electornics Co., Ltd. SCF1812 Datasheet HTML 4Page - Socay Electornics Co., Ltd. SCF1812 Datasheet HTML 5Page - Socay Electornics Co., Ltd. SCF1812 Datasheet HTML 6Page - Socay Electornics Co., Ltd.  
Zoom Inzoom in Zoom Outzoom out
 3 / 6 page
background image
Surface Mount Resettable PTCs
Revision September 12, 2016
3 / 6
@ SOCAY Electronics Corp., Ltd. 2016
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
SCF1812 Series
SOCAY Electronics Corp., Ltd.
www.socay.com
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (TS max toTP)
3
°C/second max.
Preheat:
Temperature Min (TSmin)
Temperature Max (TSmax)
Time (TSmin toTSmax)
150
°C
200
°C
60-180 seconds
Time maintained above:
Temperature(TL)
Time (TL)
217
°C
60-150 seconds
Peak/Classification Temperature(TP):
260
°C
Time within5
°C of actual peak:
Temperature
20-40 seconds
Ramp-down Rate:
6
°C/ second max.
Time 25
°C to Peak Temperature
8 minutes max.
Note: All temperatures refer to of the package, measured on the package body surface.
Solder reflow
Due to
“Lead Free” nature, Temperature and Dwelling time for the
soldering zone is higher than those for Regular. This may cause
damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard methods and aqueous
solvent.
3. Rework use standard industry practices.
4. Storage Environment:< 30℃/ 60%RH
Caution:
1. If reflow temperatures exceed the recommended profile, devices
may not meet the performance requirements.
2. Devices are not designed to be wave soldered to the bottom side
of the board.
Example
The dimension in the table below provide the recommended
pad layout for each SCF1812 device
Device
A
B
C
Nominal
Nominal
Nominal
1812 Series
3.45
1.78
3.50
Terminal pad material
Pure Tin
Soldering Characteristics
Meets EIA specification RS 186-9E, ANSI/J-std-002 Category3
Part Numbering
Part Marking
Soldering Parameters
Ramp-down
Preheat
Critical Zone
TL toTP
Time to peak temperature
(t 25℃ to peak)
TP
TL
TS(max)
TS(min)
25
Ramp-up
Time
Pad Layouts
Unit: mm
SCF XXX
– XX– 1812R
Device Size Code
Rated Voltage
Hold Current
Socay Product Code
Material Specifications
F110
F XXX
Hold Current
Logo
F XXX
XX
Hold Current
/Rated Voltage
Logo
110
16
F



Html Pages

1 2 3 4 5 6


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com