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STM32F101T6U6ATR 데이터시트(PDF) 32 Page - STMicroelectronics

부품명 STM32F101T6U6ATR
상세설명  Low-density access line, ARM®-based 32 bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
PDF  87 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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STM32F101T6U6ATR 데이터시트(HTML) 32 Page - STMicroelectronics

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Electrical characteristics
STM32F101x4, STM32F101x6
32/87
DocID15058 Rev 6
5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 10 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
PD
Power dissipation at TA =
85 °C(3)
LQFP64
-
444
mW
LQFP48
-
363
VFQFPN36
-
1000
TA
Ambient temperature
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
–40
105
TJ
Junction temperature range
-
–40
105
1. When the ADC is used, refer to Table 41: ADC characteristics.
2. It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
3. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.5: Thermal
characteristics on page 82).
4. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.5: Thermal characteristics on page 82).
Table 8. General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Table 9. Operating conditions at power-up / power-down
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time
rate
-
0
∞
µs/V
VDD fall time
rate
20
∞



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