Technical Data Sheet

3474AN/R3DB-AFGC/XR/MS

Everlight Electronics Co., Ltd.

http\\:www.everlight.com

Rev 1

Page: 8 of 10

Device Number : DT1-347-020

Prepared date: 03-10-20088

Prepared by: Grace Shen

Notes

1. Lead Forming

During lead formation, the leads should be bent at a point at least 3mm from the base of the

epoxy bulb.

Lead forming should be done before soldering.

Avoid stressing the LED package during leads forming. The stress to the base may damage

the LED’s characteristics or it may break the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures

may cause failure of the LEDs.

When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead

position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration

of the epoxy resin and this will degrade the LEDs.

2. Storage

The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from

Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or

more, they can be stored for a year in a sealed container with a nitrogen atmosphere and

moisture absorbent material.

Please avoid rapid transitions in ambient temperature, especially, in high humidity

environments where condensation can occur.

3. Soldering

Careful attention should be paid during soldering. When soldering, leave more then 3mm

from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is

recommended.

Recommended soldering conditions:

Hand Soldering

DIP Soldering

Temp. at tip of iron

300

Max.

℃

(30W

Max.)

Preheat temp.

100

Max.

℃

(60 sec

Max.)

Soldering time

3 sec Max.

Bath temp. & time

260 Max., 5 sec Max

Distance

3mm Min.(From

solder joint to

epoxy bulb)

Distance

3mm

Min.

(From

solder joint to epoxy

bulb)