9.3 Power Supply Recommendations

The REF60xx family of references have extremely low dropout voltage. The dropout specifications can be found

in Section 6.5. A minimum 0.1 µF decoupling capacitor must be connected between the VIN and GND_F pins of

the REF60xx. A typical dropout voltage versus load is shown in Figure 9-8.

0

50

100

150

200

250

±4

±3

±2

±1

0

1

2

3

4

Load Current (mA)

C017

-40ƒC

25ƒC

90ƒC

125ƒC

Figure 9-8. Dropout Voltage vs Load Current

9.4 Layout

9.4.1 Layout Guidelines

Figure 9-9 illustrates an example of a PCB layout for a data-acquisition system using the REF60xx. Some key

considerations are:

• Connect low-ESR, 0.1μF ceramic bypass capacitors between the VIN pin and ground.

• Place the REF60xx output capacitor (CL) and the ADC as close to each other as possible.

• Run two separate traces between VOUT_F, VOUT_S and the output capacitor, as shown in Figure 9-9.

• Short the GND_F and GND_S pins with a solid plane, and extend this plane to connect to the output

capacitor CL, as shown in Figure 9-9.

• Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup.

• Place the external components as close to the device as possible. This configuration prevents parasitic errors

(such as the Seebeck effect) from occurring.

• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if

possible, and only make perpendicular crossings when absolutely necessary.

9.4.2 Layout Example

RSS

CFILT

RESR

CIN

REF60xx

CL

AGND

VOUT

REFP

REFM

ADC

AGND

VIN

EN

Copyright © 2016, Texas Instruments Incorporated

Figure 9-9. Layout Example

www.ti.com

REF60

SBOS708C – MAY 2016 – REVISED APRIL 2026

Copyright © 2026 Texas Instruments Incorporated

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