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LPW5202FDB5F21 데이터시트(PDF) 5 Page - Lowpower Semiconductor inc |
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LPW5202FDB5F21 데이터시트(HTML) 5 Page - Lowpower Semiconductor inc |
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5 / 14 page ![]() www.lowpowersemi.com Email: marketing@lowpowersemi.com Page 5 of 14 LPW5202 LPW5202 Rev1.7 June-2022 Absolute Maximum Ratings (Note 1) ⚫ IN to GND --------------------------------------------------------------------------------------------------------------------- -0.3V to 7V ⚫ OUT to GND ------------------------------------------------------------------------------------------------------------------ -0.3V to 7V ⚫ EN to GND -------------------------------------------------------------------------------------------------------------------- -0.3V to 7V ⚫ ISET to GND ----------------------------------------------------------------------------------------------------------------- -0.3V to 7V ⚫ FLAGB to GND -------------------------------------------------------------------------------------------------------------- -0.3V to 7V ⚫ Maximum Junction Temperature (TA) --------------------------------------------------------------------------------------- +150°C ⚫ Storage Temperature Range -------------------------------------------------------------------------------------- -65°C to +150°C ⚫ Maximum Soldering Temperature (at leads, 10 seconds) -------------------------------------------------------------- +260°C Note 1: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, instead of functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Information ⚫ Maximum Power Dissipation (PD, TA <= 25℃) ------------------------------------------------------------------------------- 0.6W ⚫ Thermal Resistance (From junction to ambient, θJA) (Note 2)------------------------------------------------------------ 203°C/W ⚫ Thermal Resistance (From junction to case, θJC) (Note 2) ---------------------------------------------------------------- 120°C/W Note 2: It is based on 2S2P JEDEC standard PCB. ESD Ratings ⚫ HBM (Human Body Model, JEDEC JS-001) ------------------------------------------------------------------------------ ±4000V ⚫ CDM (Charged Device Model, JEDEC JS-002) --------------------------------------------------------------------------- ±500V Recommended Operating Conditions ⚫ Input Voltage --------------------------------------------------------------------------------------------------------------- 2.4V to 6.0V ⚫ Enable Voltage ------------------------------------------------------------------------------------------------------------------ 0V to 6V ⚫ Limited current setting ------------------------------------------------------------------------------------------------ 200mA to 2.5A ⚫ Ambient Temperature -------------------------------------------------------------------------------------------------- -40°C to 85°C Electrical Characteristics The following parameters are guaranteed under condition VIN =5V, TA = -40°C to 85°C unless otherwise noted, TA = 25°C for typical value. Parameters Symbol Test conditions Min Typ Max Unit On-resistance RDS(ON) VIN = 5V, IOUT=200mA, TA=25°C 70 100 mΩ Input quiescent current IQ VIN = 5V, OUT floating, VEN = 5V 30 50 μA Input shutdown current ISD VIN = 5V, OUT grounded, VEN = 0V 200 nA Under voltage lockout level VUVLO_F IN voltage falling 2.25 2.5 2.75 V VUVLO_R IN voltage rising 2.4 2.65 2.9 V |
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